RCAPS Seminar: Tracing System for Products Produced by 3D Printing in the Supply Chain: A New Concept of DLIP (Distributed Ledger Innovation Platform) in Innovation

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RCAPS Seminar: Tracing System for Products Produced by 3D Printing in the Supply Chain: A New Concept of DLIP (Distributed Ledger Innovation Platform) in Innovation

Jun 16, 2025

RCAPS Seminar: Tracing System for Products Produced by 3D Printing in the Supply Chain: A New Concept of DLIP (Distributed Ledger Innovation Platform) in Innovation

On June 16^th, an RCAPS seminar was held, hosted by Professor FUJII Seiichi of the College of International Management. The seminar welcomed Dr. Nobuyuki Fukawa from the Missouri University of Science and Technology as the guest speaker.

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RCAPS Seminar: Tracing System for Products Produced by 3D Printing in the Supply Chain: A New Concept of DLIP (Distributed Ledger Innovation Platform) in Innovation

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